Thermally Conductive Gels

CL-Electronics cooperates here with various, well-known suppliers. The specifications of these products are:

High conformal, pre-crosslinked and single component compounds. The cross-linked gel structure provides excellent long-term thermal stability and reliable performance.

Ideal for filling variable gaps between multiple components and a common heat sink.

They offer high conformability at low pressure. No cooling, mixing or filling issues arise in storage and allows for touch-up after initial application.