Form in Place Connections

CL-Electronics cooperates here with various, well-known suppliers. The specifications of these products are:

Form-in-Place connections are designed for heat transfer without excessive compressive force in electronic cooling applications. These versatile, liquid and reactive compounds can be dispensed and then cured into complex geometries to cool multi-height components on a PCB.

Excellent blend of high thermal conductivity, flexibility and ease of use.

Adaptable to irregular shapes without undue stress on components.

Ready-to-use cartridge system eliminates the need for weighing, mixing and degassing.

Various kit sizes and configurations available for any application (portable dual cartridges).