Thermal Grease

CL-Electronics cooperates here with various, well-known suppliers. The specifications of these products are:

The performance range meets the simplest to the most demanding thermal requirements.

These materials are sieved, scraped or dispensed and require virtually no compressive force to conform under normal assembly pressures.

Silicone-based materials conduct heat between a hot component and a heat sink or housing.

Meets variable interface tolerances in electronics assemblies and heat sink applications.

Highly conformable materials require no cure cycle, mixing or cooling.

Materials support high performance applications requiring high conductivity with minimal bond line thickness.

Ideal for field rework and repair.