Thermal greases

Range of performance covering the simplest to the most demanding thermal requirements. These materials are screened, stenciled or dispensed and require virtually no compressive force to conform under typical assembly pressures.

FEATURES:

  • Silicone based materials conduct heat between a hot component and a heat sink or enclosure
  • Fills interface variable tolerances in electronics assemblies and heat sink applications
  • Dispensable, highly conformable materials require no cure cycle, mixing or refrigeration
  • Supports high power applications requiring material
  • with minimum bond line thickness and high conductivity
  • Ideal for rework and field repair situations

APPLICATIONS:

  • Mobile, desktop, server CPUs, memory modules
  • Power conversion equipment
  • Power supplies and UPS
  • Power semiconductors
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